Equipment Capabilities

Equipment Quantity Description Special Capability Capacity Board Handling
MPM 3000 2 Screen Printer Alignment accuracy: +/- 0.001in (0.025mm) Cycle time: < 7 sec including transport & vision. Board size: Max – 22in. x 20 in. (559mm x 508 mm) Min 2 in. x 1 in. (50.0 mm x 50.0mm)
FUJI CP62E 2 High Speed Chip Shooter Placement accuracy: +/- 0.1 mm (3 sigma) in XY direction, 99.99% placing reliability; Component range: 0201 to 20mm x 20mm World's fastest placement speed: 0.09 sec/chip, 40,000 placements/hour Maximum: 356 mm (W) x 457 mm (L) Minimum: 50mm (W) x 80mm (L)
FUJI CP65 1 High Speed Chip Shooter Placement accuracy: +/- 0.1 mm (3 sigma) in XY direction, 99.99% placing reliability; Component range: 0201 to 30mm x30mm World's fastest placement speed: 0.09 sec/chip, 40,000 placements/hour Maximum: 356 mm (W) x 457 mm (L) Minimum: 50mm (W) x 80mm (L)
UNIVERSAL HSP 1 High Speed Chip Shooter Placement Performance 99.99% component range: 0402 to 20mm square components Maximum placement speed of 0.10 seconds/component  (36,000 placements/hour) Maximum – 457 x 508 mm Minimum 50.0 mm x 50.0mm
UNIVERSAL GSM 2 2 High Volume Fine Pitch Pick&Place Placement accuracy: +/- 0.00150 in. (0.0381 mm) XY Repeatability: < 0.000667 in. (0.0169mm) XY Rotational Accuracy: +/- 0.06 Degree Test board rated at 12,000 components per hour Maximum – 22in. x 20 in. (559mm x 508 mm) Minimum 2 in. x 1 in. (50.0 mm x 50.0mm)
Tempco LF-400B 2 Wave Solder Solder pot capacity 420 fg/(925 lbs.) Both RoHS & non-RoHS lines available Conveyor speed  0.5-2.2 m/min (20"-87"/min) Maximum PCB size: 450 mm x 450 mm (18"x18")
BTU Paragon 150 Reflow oven 1 10-Zone Reflow Solder Oven System Atmosphere control in 10 Heated zones,  Operating temperature rating of 400C 10 Heated zones, Lead-free process capable, Nitrogen-process capable Belt speed: Nominal 45 IPM (1143 mm/min) Conveyor width 22 " / 55 cm  Cooling length: 48" / 122cm  Heated Length: 150 in/ 381 cm
ELECTROVERT OMNI7 Reflow oven 1 7-Zone Reflow Solder Oven System Atmosphere control in 7 Heated zones, Operating temperature rating of 352 C 7 Heated zones, Lead-free process capable , nitrogen-process capable Conveyor width 22 " / 55 cm Cooling length: 50.9" / 1293mm Heated Length: 150.8 in/ 3855 mm
YES TECH AOI 1 Automatic in-line optical inspection station Detection Capability :  incorrect component positioning, missing, wrong polarity, skew, tombstone excess solder, shorts, solder balls and insufficient solder  2 SQ. IN./SEC :.= 50,000 components per hour Maximum board size – 16x16 (450mm x 400mm) Minimum 2 in. x 1 in. (50.0 mm x 50.0mm)
SMT Line 1 Surface mount technology with FUJI chipshooter technology Our SMT line configuration is flexible and ranges from prototype to low volume, high mix and high volume production Placements: 45,000/hour 992,700 /day  
SMT Line 2 Surface mount technology with UNIVERSAL chipshooter technology Our SMT line configuration is flexible and ranges from prototype to low volume, high mix and high volume production Placements: 35,000/hour 794,160 /day  
Facility Floor space: 44,710.33 Sq/Ft Fire protection system: Hose cabinets system supplied by 13,263 Gal. tank and 200 GMP pump  Electrical Power: 500 KVA transformer Lighting: T5 fixtures HVAC: Evaporative coolers Loading docks: Four (4) 8' x 12' dock doors